Marvell Technology, Inc. Leads the Way
Marvell Technology, Inc., a well-established leader in data infrastructure semiconductor solutions, has officially unveiled ARA, the industry’s first 3 nm 1.6 Tbps PAM4 interconnects platform. This groundbreaking solution is designed with advanced 200 Gbps electrical and optical interfaces, showcasing how Marvell continues to set high standards in technological innovation.
A Significant Leap Forward in PAM4 Technology
Building upon the success of the Nova 2 DSP, which was recognized as the first 5 nm 1.6 Tbps PAM4 DSP with similar speed capabilities, ARA offers a more powerful alternative. Leveraging the heroic advancements of the Marvell 3 nm platform, it features state-of-the-art 200 Gbps SerDes and integrated optical modulator drivers. This enables a reduction of over 20% in the power of the 1.6 Tbps optical module, significantly enhancing energy efficiency.
High Performance Meets Energy Efficiency
The Marvell ARA platform is particularly noteworthy for its ability to adapt to the escalating demands of AI workloads in modern data centers. By improving energy efficiency, it not only cuts operational costs but also facilitates new AI server and networking architectures. As a result, organizations can align performance needs with the stringent power constraints commonly experienced in data centers.
By integrating eight 200 Gbps electrical lanes and eight 200 Gbps optical lanes, ARA achieves an impressive 1.6 Tbps throughput in a streamlined, standardized module form factor. This combination of advanced 3 nm technology and laser driver integration reduces module design complexity and costs while paving the way for the next generation of AI and cloud infrastructure.
