The De-Lidding Process Explained
The eagerly anticipated AMD Ryzen 7 9800X3D processor has already made its way into the hands of hardware modders. Their latest endeavor? The de-lidding process, which involves meticulously removing the integrated heat spreader (IHS) to expose the true nature of this powerful chip. In the pictures shared, the CPU complex die (CCD) reveals a rather unassuming appearance, lacking any signs of the L3D layer on top, in stark contrast to its predecessor, the Ryzen 7 7800X3D.
Innovations in Stacking Design
Rumors have circulated regarding significant redesigns in AMD’s 9000X3D series, particularly concerning the arrangement of the 3D V-Cache die (L3D) and CCD. Unlike previous generations, where the L3D was situated atop the CCD, the 9800X3D embraces a new inverted stacking approach. This innovative arrangement positions the CCD on top, potentially enhancing thermal performance—a crucial factor for demanding users.
Thermals and Performance Expectations
The AMD Ryzen 7 9800X3D is poised for impressive performance, boasting a total design power (TDP) of 120 watts and a phenomenal boost clock of up to 5.20 GHz. Early reports suggest that this revised stacking strategy could ensure superior thermal management, allowing the CPU cores to operate efficiently and potentially rival non-X3D models like the 9700X. With AMD’s teaser of “X3D Reimagined,” it’s clear there’s more to discover under the hood of the 9800X3D.
