Introduction
Samsung Electronics, a world leader in advanced memory technology, has made a significant announcement. The company has started mass production of the industry’s thinnest 12-nanometer (nm) class, 12-gigabyte (GB) and 16-GB LPDDR5X DRAM packages. This milestone further solidifies Samsung’s leadership in the low-power DRAM market.
Ultra-Slim Packages for Better Performance
Leveraging its extensive expertise in chip packaging, Samsung has delivered ultra-slim LPDDR5X DRAM packages. These new packages create additional space within mobile devices, which facilitates better airflow and supports easier thermal management. Effective thermal control is becoming increasingly critical, especially for high-performance applications with advanced features such as on-device AI.
Industry-Leading Features
Samsung’s LPDDR5X DRAM sets new standards for high-performance on-device AI solutions. The memory packages offer not only superior LPDDR performance but also advanced thermal management in an ultra-compact form. As Yongcheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics, stated, the company is committed to continuous innovation and close collaboration with its customers to deliver solutions that meet the future needs of the low-power DRAM market.
Technical Specifications and Future Plans
The new LPDDR5X DRAM packages are the thinnest 12 nm-class LPDDR DRAM in a 4-stack structure, with a thickness of approximately 0.65 millimeters (mm). By optimizing printed circuit board (PCB) and epoxy molding compound (EMC) techniques, the thickness is reduced by about 9% and heat resistance improved by approximately 21.2%, compared to the previous generation. Samsung’s optimized back-lapping process is also used to minimize package height.
Furthermore, Samsung plans to continue expanding the low-power DRAM market. They will supply their 0.65 mm LPDDR5X DRAM to mobile processor makers and mobile device manufacturers. As the demand for high-performance, high-density mobile memory solutions in smaller package sizes continues to grow, Samsung intends to develop 6-layer 24 GB and 8-layer 32 GB modules into the thinnest LPDDR DRAM packages for future devices.
