Introduction to Synopsys’ 40G UCIE IP Solution
In a significant advancement for the semiconductor industry, Synopsys, Inc. recently announced the release of the industry’s first complete Ultra Chip-to-Chip Interconnect Express (UCIE) IP solution capable of operating at speeds of up to 40 Gbps per pin. This innovative offering has been developed in response to the increasing compute performance requirements of the world’s fastest AI data centers.
Importance of UCIE Interconnect in AI Data Centers
The UCIE interconnect has quickly become the de facto standard for die-to-die connectivity. It plays a critical role in facilitating high-bandwidth, low-latency communication between multi-die packages. By enabling more efficient data transfer across various heterogeneous and homogeneous dies, or chiplets, this technology fosters improved performance in today’s AI data center systems.
Flexibility and Support in Design with Synopsys’ 40G UCIE IP
One of the standout features of Synopsys’ 40G UCIE IP is its support for both organic substrate and high-density advanced packaging technologies. This flexibility allows designers to explore various packaging options that align with their specific requirements. The complete solution encompasses not only the physical layer (PHY) and controller but also includes verification IP, making it an essential component of Synopsys’ scalable multi-die solution. This solution facilitates rapid heterogeneous integration from initial architecture exploration through to manufacturing.
