MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of ultra-efficient 4 nm chips for high-tech mobile offerings. Providing best-in-class power efficiency and excellent performance, the Dimensity 7300 chipsets enable effortless multitasking, superior photography, accelerated gaming, and AI-enhanced computing; additionally, the Dimensity 7300X is designed with flip-style foldable devices in mind, providing support for dual displays.
Other key features of the Dimensity 7300 and the Dimensity 7300X include:
-MediaTek 5G UltraSave 3.0+ technology incorporating a complete suite of R16 power saving enhancements, plus MediaTek’s own
– optimizations that provide between 13-30% greater power efficiency compared to competitor alternatives in common 5G sub-6 GHz connectivity scenarios.
– Support for up to 3.27 Gb/s 5G downlink via 3CC carrier aggregation, providing faster downlink speeds within urban and suburban environments.
– Tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connectivity.
Dual 5G SIM support with dual VoNR to give users more choice.
