Eliyan Corporation Unveils Revolutionary nuLink-2.0: A Leap in Chiplet Interconnect Technology

The Breakthrough of nuLink-2.0

Today, Eliyan Corporation proudly announces the successful delivery of the first silicon for its revolutionary nuLink-2.0 PHY, produced with cutting-edge 3 nm technology. This milestone signifies an advancement that the semiconductor industry has been eagerly awaiting. With a staggering capability of 64 Gbps per bump, nuLink-2.0 stands as the industry’s highest performance die-to-die PHY solution.

Enhancing Connectivity

The nuLink-2.0 not only adheres to the UCIE standard but also offers double the bandwidth for die-to-die connectivity compared to previous benchmarks. This achievement is nothing short of remarkable, particularly given its efficiency regarding power consumption, area utilization, and latency. Eliyan is transforming multi-die architectures, ensuring that performance is preserved while pushing the boundaries of what is possible.

Introducing UMI: A Paradigm Shift

Adding to the excitement, Eliyan’s nuLink-2.0 also features support for Universal Memory Interconnect (UMI), a groundbreaking chiplet interconnect technology. UMI enhances die-to-memory bandwidth efficiency by more than 2x, thanks to its dynamic bidirectional PHY. With specifications nearing completion in collaboration with the Open Compute Project (OCP) as part of Bow 2.1, the implications for future designs are immense.

As Eliyan Corporation continues to lead and innovate within the semiconductor space, the nuLink-2.0 embodies a commitment to advancing interconnect technologies and paving the way for more sophisticated and efficient multi-die solutions.

Karol J. Jones
Karol J. Jones
4993 Laurel Lee Kansas City, MO 64106

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