Introduction to the Chips Program
The U.S. Department of Commerce has recently made waves by finalizing $1.4 billion in funding under the Chips National Advanced Packaging Manufacturing Program (NAPMP). This initiative aims to strengthen U.S. leadership in advanced packaging and facilitate the validation and scaling of new technologies in domestic manufacturing.
The Financial Breakdown
Among the awards, a notable $300 million is allocated to key players in the field, such as Absolics Inc., Applied Materials Inc., and Arizona State University, thanks to the first Notice of Funding Opportunity (NOFO). These funds are earmarked for advanced substrates and material research, a crucial component in developing the advanced node chips that will be both manufactured and packaged in the United States.
Future Implications for Domestic Manufacturing
In addition, the program is set to negotiate further funding—specifically the previously mentioned $1.1 billion directed towards Natcast. This financial backing will enhance advanced packaging capabilities within the Chips for America NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility (PPF).
With these strategic investments, the Chips NAPMP is not just a financial allocation; it’s a significant step toward establishing a self-sustaining, high-volume, domestic advanced packaging industry. The hope is to create an ecosystem where U.S. manufacturing can thrive without dependence on overseas markets, securing a competitive edge in the global technology landscape.
